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Contributed articles written by Dave Huntley, President, KINESYS Software:
The acceptance and implementation of single device tracking has been made much easier with the release of SEMI standard E142. This article discusses how, when and why to implement this new standard on the assembly floor.
Moving manufacturing data through the semiconductor supply chain has become vastly more complex, in part due to the growth of outsourcing and the many companies involved in bringing a device from raw silicon to packaged part. The acceptance of new standards in the wafer-mapping area, however, should resolve many current supply-chain integration problems.
With packaging costs relatively flat and ASP (average selling price) erosion running at 15 percent to 20 percent per year, final manufacturing will likely account for up to 80 percent of product cost within 15 years….Strip test versus singulated test is one area that increased investment in final manufacturing may provide a significant pay off.
Manufacturing industry's pressing need for open systems standards for traceability
is motivating new developments in standards for test assembly and packaging.
Universal has integrated the Kinesys ALPS software with the GSM Platform operating system, allowing the user to load up to +100 different map formats. This novel software integration provides the flexibility to simultaneously connect to a map server as well as a central host system.
Significant cost savings can be achieved in semiconductor TAP (test, assembly
and packaging)
factories by using matrix (strips) sub-strates in conjunction with parallel
unit strip testing instead of conven-tional singulated unit testing....Integrating
strip mapping with die attach is the key to enable feed-for-ward and feed-back
control of the TAP process as well as deliver critical failure data back to
the wafer pro-cessing plant.
As manufacturing becomes more complex, manual methods of production are no longer viable for many parts of the process. One of these is wafer mapping for assembly production. Dave Huntley the president of Kinesys Software discusses why inkless mapping is set to become the method of choice.
...Now that the fab automation segment has matured significantly, test, assembly and packaging (TAP) automation is catching up with fab automation....
...with the advent of new packaging technologies, such as flip chip and chip scale packages, the complexity and cost of assembly underscores the need for more advanced automation.
Despite the downturn, companies with deep pockets are making huge investments in 300mm wafer processing equipment....
...Comprehensive automation projects are underway in new 300mm fabs. But what is being done about automation of 300mm test, assembly and packaging (TAP)? Has the automation challenge been neglected? What are the challenges that a back-end factory manager will face?
Inkless assembly... uses electronic wafer maps instead of ink to classify
good and bad die. In addition, inkless assembly enables software-driven material
inventory tracking and gives process control engineers a usable form of history
that can help them determine yield loss.
...improves throughput by eliminating the overhead of detection, and results
in faster cycle times and lower cost.
...Today, there is a set of recommendations that can help smooth any transition
from ink to inkless assembly.